Cause analysis and solutions for electroplating nickel gold tin plates on multi-layer circuit boards
Click:856 Date:2025-10-17
The analysis of the reasons for electroplating nickel gold plates on multi-layer circuit boards can be studied from the following aspects: adjusting 1 and false gold plating layers, washing the nickel layer for too long or oxidation passivation, paying attention to pure water, and strengthening the control of washing time with hot water.