Click：891    Date：2025-10-17

With the transformation of surface soldering to lead-free type, the soldering temperature that circuit boards need to withstand becomes extremely high, and the requirements for the thermal shock resistance of the surface solder mask layer are becoming higher and higher. The requirements for terminal surface treatment and the peel strength of the solder mask layer (ink, cover film), as well as the bonding strength with the base copper, are also increasing.